Advanced Packaging
Technology
Our OSAT division provides cutting-edge backend solutions to maximize thermal and electrical performance, from high-density flip-chip to ultra-compact wafer-level packaging.
Flip-Chip BGA
High I/O density packaging for advanced logic processors and high-performance computing applications.
- Up to 3000+ I/O
- Copper pillar bumping
- Multi-die support
System-in-Package
Heterogeneous integration of logic, memory, and RF components into a single compact module.
- 2.5D/3D stacking
- Through-silicon vias
- Embedded passives
Wafer-Level CSP
Ultra-compact chip-scale packaging for mobile, wearable, and space-constrained IoT devices.
- Fan-out WLP
- < 0.4mm profile
- High thermal performance
Turnkey Backend Solutions
From wafer probe and bumping through final test and reliability qualification — all under one roof.