Compound Fab
GaAs, InP, and SiGe compound semiconductor processing alongside MEMS inertial, pressure, and environmental sensor fabrication.
Quick Specs
Core Capabilities
Our operations provide specialized, uncompromising capabilities for compound fab. We deliver robust, scalable execution from initial design through high-volume production.
How It Works
Our end-to-end manufacturing workflow from design review through final quality validation.
Epitaxial Growth
Growing single-crystal compound layers (GaAs, GaN, InP) using MOCVD or MBE. This foundational process ensures unparalleled reliability, scaling efficiently from small prototype phases to massive, global production volumes.
Lithography
Sub-micron patterning customized for compound semiconductor topologies. This foundational process ensures unparalleled reliability, scaling efficiently from small prototype phases to massive, global production volumes.
Etching & Deposition
Dry etching (ICP-RIE) and metal/dielectric deposition (PECVD, Sputtering). This foundational process ensures unparalleled reliability, scaling efficiently from small prototype phases to massive, global production volumes.
MEMS Release
Deep silicon etching and sacrificial layer release to create movable micro-structures. This foundational process ensures unparalleled reliability, scaling efficiently from small prototype phases to massive, global production volumes.
Probe Testing
On-wafer DC and RF characterization of compound devices and sensors. This foundational process ensures unparalleled reliability, scaling efficiently from small prototype phases to massive, global production volumes.
Dicing & Packaging
Specialized singulation and packaging, including vacuum-sealed MEMS cavities. This foundational process ensures unparalleled reliability, scaling efficiently from small prototype phases to massive, global production volumes.
Technical Specifications
Detailed specifications and manufacturing parameters.
Quality & Standards
Target Applications
Ready to start your project?
Speak with our compound fab experts to review your specifications, plan your ramp, and get a custom quote.
Frequently Asked Questions
Need more technical details? Find answers below or contact our engineering team.
Advanced Semiconductor Manufacturing Excellence
In the highly competitive landscape of global technology, INDNIX stands at the forefront of advanced semiconductor manufacturing, industrial automation, and enterprise-grade software solutions.
Silicon to Assembly
End-to-end solutions spanning from initial microscopic silicon design to high-volume macroscopic assembly lines.
Complex Orchestration
Profound orchestration of supply chains instead of merely relying on hardware scaling trends like Moore's Law.
Strict Quality Control
Systemic operational transparency enforcing uncompromising quality controls and defect elimination.
Unprecedented Efficiency
Integrating high-capacity hardware lines with cloud-native software drives maximum theoretical yield parameters.
Unwavering Commitment to Quality & Traceability
When industries ranging from automotive to aerospace partner with INDNIX, they invest in an unwavering commitment to quality. Defect density is not an abstract metric; it is a critical vulnerability.
DFM and DFT Methodologies: Constructing highly sophisticated digital twins of every product for rigorous thermal and stress modeling before fabrication.
High-resolution AOI & 3D X-Ray: Ensuring every via, trace, and component is analyzed in real-time.
Rigid International Standards: Complete compliance with ISO 9001, IATF 16949, and AEC-Q100.
Software-Defined Manufacturing
Traditional manufacturing relies heavily on siloed systems creating debilitating blind spots. We've engineered a radical departure by developing completely unified digital infrastructure.
Dynamic Sourcing
Algorithms ingest terabytes of telemetry data, orchestrating procurement routing and predictive maintenance continuously.
Hyper-Resilient Pipeline
Remarkably immune to conventional macroeconomic supply disruptions or localized shortages via neural networks.
Digital Control Plane
Abstracting physical complexity to provide partners unprecedented real-time visibility into their product lifecycle.
Scaling Across Diverse Sectors
Our core capabilities service specialized sectors efficiently. From 28nm-65nm microprocessors delivering low-power IoT performance, to compound GaAs and InP RF amplifiers for 5G, and robust PMICs for the demanding EV market.
Sustainable Engineering & Future
The environmental impact of industrial scalability cannot be ignored. We pioneer environmentally conscious manufacturing, implementing recycling loops to minimize chemical runoff and reduce water consumption.
Aligning with a visionary partner building a smarter, cleaner world.
Get in Touch
Whether you're looking to secure autonomous semiconductor supply chains or orchestrate global deployments, our execution teams are ready.
Send us a message
INDNIX Technology Limited
Rishi Bankim Shilpaudyan, Naihati, West Bengal, 743165, India
Headquarters
INDNIX Technology Limited
Rishi Bankim Shilpaudyan, Naihati, WB
Direct Line
+91-8100488233
Official Inquiry
official@indnix.com