Compound RF & MEMS Sensors
High-yield GHz-band devices for cellular infrastructure. Ruggedized pressure, environmental, and spatial sensors tailored for off-road agricultural machinery and defense applications.
Core Capabilities
Our cleanrooms provide specialized, uncompromising capabilities for compound rf & mems sensors. We deliver robust, sovereign execution from initial layout and SPICE simulation through tape-out and high-volume wafer output.
Process Flow
Epitaxial Growth
Growing single-crystal compound layers (GaAs, GaN, InP) using MOCVD or MBE.
Lithography
Sub-micron patterning customized for compound semiconductor topologies.
Etching & Deposition
Dry etching (ICP-RIE) and metal/dielectric deposition (PECVD, Sputtering).
MEMS Release
Deep silicon etching and sacrificial layer release to create movable micro-structures.
Probe Testing
On-wafer DC and RF characterization of compound devices and sensors.
Dicing & Packaging
Specialized singulation and packaging, including vacuum-sealed MEMS cavities.
Epitaxial Growth
Growing single-crystal compound layers (GaAs, GaN, InP) using MOCVD or MBE.
Lithography
Sub-micron patterning customized for compound semiconductor topologies.
Etching & Deposition
Dry etching (ICP-RIE) and metal/dielectric deposition (PECVD, Sputtering).
MEMS Release
Deep silicon etching and sacrificial layer release to create movable micro-structures.
Probe Testing
On-wafer DC and RF characterization of compound devices and sensors.
Dicing & Packaging
Specialized singulation and packaging, including vacuum-sealed MEMS cavities.
Technical Specifications
Quality & Standards
Target Applications
Frequently Asked Questions
Technical Specifications & Foundry FAQ
Other Manufacturing Divisions
Microcontrollers (MCUs) & Logic
32-bit automotive-grade microprocessors used in Engine Control Units (ECUs), Anti-lock Braking Systems (ABS), and advanced driver-assistance systems (ADAS). Low-power IoT SoCs integrating wireless stacks.
Power Management ICs (PMICs)
DC-DC converters, Low Dropout Regulators (LDOs), and battery management systems. Critical components for the surging Electric Vehicle (EV) market and renewable smart-grid power inverters.
Analog & Mixed-Signal ICs
Precision Analog-to-Digital Converters (ADCs), DACs, and operational amplifiers required for telecommunications infrastructure.
Advanced Semiconductor Manufacturing Excellence
In the highly competitive landscape of global technology, INDNIX stands at the forefront of advanced semiconductor manufacturing, industrial automation, and enterprise-grade software solutions.
Silicon to Assembly
End-to-end solutions spanning from initial microscopic silicon design to high-volume macroscopic assembly lines.
Complex Orchestration
Profound orchestration of supply chains instead of merely relying on hardware scaling trends like Moore's Law.
Strict Quality Control
Systemic operational transparency enforcing uncompromising quality controls and defect elimination.
Unprecedented Efficiency
Integrating high-capacity hardware lines with cloud-native software drives maximum theoretical yield parameters.
Unwavering Quality & Traceability
When industries ranging from automotive to aerospace partner with INDNIX, they invest in an unwavering commitment to quality. Defect density is not an abstract metric; it is a critical vulnerability.
DFM and DFT Methodologies
Constructing highly sophisticated digital twins of every product for rigorous thermal and stress modeling before fabrication.
High-resolution AOI & 3D X-Ray
Ensuring every via, trace, and component is analyzed in real-time.
Rigid International Standards
Complete compliance with ISO 9001, IATF 16949, and AEC-Q100.
# Initializing Digital Twin Simulator
$ npm run start:digital-twin
> Loading wafer routing algorithms...
> Connecting to MES database API...
> Status: Connection ESTABLISHED
Lot Routing Telemetry
Lot: #INDNIX-28NM-A01
Status: Optimal Yield Path
Loss Mitigation: 0.00% Defect Delta
Software-Defined Manufacturing
Traditional manufacturing relies heavily on siloed systems creating debilitating blind spots. We've engineered a radical departure by developing completely unified digital infrastructure.
Dynamic Sourcing
Algorithms ingest terabytes of telemetry data, orchestrating procurement routing and predictive maintenance continuously.
Hyper-Resilient Pipeline
Remarkably immune to conventional macroeconomic supply disruptions or localized shortages via neural networks.
Digital Control Plane
Abstracting physical complexity to provide partners unprecedented real-time visibility into their product lifecycle.
Scaling Across Diverse Sectors
Our core capabilities service specialized sectors efficiently. From 28nm-65nm microprocessors delivering low-power IoT performance, to compound GaAs and InP RF amplifiers for 5G, and robust PMICs for the demanding EV market.
Sustainable Engineering & Future
The environmental impact of industrial semiconductor scalability cannot be ignored. We pioneer environmentally conscious manufacturing, implementing closed recycling loops to minimize chemical runoff and reduce water consumption.
Eco-Conscious Fab Standards
Get in Touch
Whether you're looking to secure sovereign semiconductor capacity, collaborate on cleanroom joint R&D, or orchestrate global deployments, our execution teams are ready.
Send us a direct message
Mega-Fab Site & Registered Office
INDNIX Technology Limited
Haringhata Industrial Park, Ayeshpur, Nadia, West Bengal 741249
Direct Line
+91-9062215151
Official Inquiry
official@indnix.com