Careers at INDNIX
About Us
Build the Future of Silicon
Our commitment to our vision drives everything we do. We combine decades of domain expertise with cutting-edge cloud software and automated production lines to deliver unprecedented results.
Hiring Now: Be At The Forefront of the Revolution
Join INDNIX Technology Limited and operate within a highly complex, fiercely innovative 7-acre manufacturing park in West Bengal. We are actively hiring for 3,000 high-value direct positions across 11 key divisions.
1Executive Management & Governance
This tier oversees the strategic, financial, and regulatory compliance of the entire 7-acre campus.
Managing Director (MD)
Lead the overall strategic direction of INDNIX Technology. Responsible for P&L, government relations (India Semiconductor Mission), and ensuring the 7-acre campus meets strict operational and financial targets.
Educational Background
MBA / Ph.D. in Engineering
Minimum Qualifications
Minimum 20 years of progressive leadership in a top-tier semiconductor foundry or high-tech manufacturing facility. Ph.D. or top-tier MBA strongly preferred.
VP of Foundry Operations
Oversee day-to-day cleanroom manufacturing. Drive yield improvements, ensure zero-defect compliance, and manage massive capital expenditure for lithography and deposition tools.
Educational Background
Ph.D. or M.Tech (Microelectronics / Material Science)
Minimum Qualifications
15+ years in fab operations. Must have hands-on experience scaling nodes from 180nm down to 28nm in a high-volume manufacturing (HVM) environment.
VP of Governance & Legal
Ensure complete compliance with ITAR, EAR, and domestic export control laws. Negotiate multi-million dollar Intellectual Property (IP) licensing and manage the legal framework for government subsidies.
Educational Background
LLB / LLM (Corporate Law) + MBA
Minimum Qualifications
10+ years in tech/corporate law. Proven track record negotiating complex IP transfers and handling government liaisons.
Chief Financial Officer (CFO)
Direct the ₹26,000 Crore investment roadmap. Manage massive CAPEX depreciation, structure foreign direct investments, and oversee strict financial reporting for our sovereign and private backers.
Educational Background
Chartered Accountant (CA) / CFA
Minimum Qualifications
CA/CFA with 15+ years in deep-tech or heavy manufacturing finance. Deep understanding of high-CAPEX depreciation models.
Market Intelligence Analyst
Analyze market intelligence, industry trends, and strategic investment profiles as Market Intelligence Analyst to steer company growth.
Educational Background
MBA or Master's in Finance, Economics, or Data Analytics
Minimum Qualifications
Experience in corporate strategy, semiconductor market analysis, and economic feasibility modeling.
Program Manager - NPI
Analyze market intelligence, industry trends, and strategic investment profiles as Program Manager - NPI to steer company growth.
Educational Background
MBA or Master's in Finance, Economics, or Data Analytics
Minimum Qualifications
Experience in corporate strategy, semiconductor market analysis, and economic feasibility modeling.
IC Accounts Manager
Analyze market intelligence, industry trends, and strategic investment profiles as IC Accounts Manager to steer company growth.
Educational Background
MBA or Master's in Finance, Economics, or Data Analytics
Minimum Qualifications
Experience in corporate strategy, semiconductor market analysis, and economic feasibility modeling.
Technical Program Manager - SMT
Analyze market intelligence, industry trends, and strategic investment profiles as Technical Program Manager - SMT to steer company growth.
Educational Background
MBA or Master's in Finance, Economics, or Data Analytics
Minimum Qualifications
Experience in corporate strategy, semiconductor market analysis, and economic feasibility modeling.
Technical Program Manager - Systems
Analyze market intelligence, industry trends, and strategic investment profiles as Technical Program Manager - Systems to steer company growth.
Educational Background
MBA or Master's in Finance, Economics, or Data Analytics
Minimum Qualifications
Experience in corporate strategy, semiconductor market analysis, and economic feasibility modeling.
Program Manager - IC Projects
Analyze market intelligence, industry trends, and strategic investment profiles as Program Manager - IC Projects to steer company growth.
Educational Background
MBA or Master's in Finance, Economics, or Data Analytics
Minimum Qualifications
Experience in corporate strategy, semiconductor market analysis, and economic feasibility modeling.
2Process Engineering (Building 1 & 2 Cleanrooms)
These engineers own the 'recipes' for manufacturing the microchips. They are responsible for optimizing the chemical and physical steps (Lithography, Etch, Deposition) to ensure high yield.
Process Integration Manager
Own the end-to-end wafer manufacturing flow. You will solve complex cross-module defects where lithography interacts with etching and deposition steps, ensuring final electrical specifications are met.
Educational Background
Ph.D. / M.Tech (Physics, EE, Material Science)
Minimum Qualifications
10+ years experience in a commercial fab. Must understand the entire CMOS process flow. Ph.D. is highly preferred.
Photolithography Engineers
Manage the most critical step in the fab. You will program and optimize ASML scanners to print nanoscale patterns, adjusting optical proximity correction (OPC) and spin-coating parameters.
Educational Background
M.Tech / B.Tech (Physics, Optics, Chemical Eng.)
Minimum Qualifications
3-8 years experience specifically on DUV/EUV scanners. Strong understanding of optical physics and photoresist polymers.
Plasma Etch / DRIE Engineers
Develop anisotropic etching recipes using reactive plasmas. You will tune gas ratios (e.g., SF6, C4F8) and RF power to carve precise, high-aspect-ratio trenches in silicon.
Educational Background
M.Tech / B.Tech (Chemical Eng, Material Science)
Minimum Qualifications
3-8 years experience with Lam Research, Applied Materials, or Tokyo Electron etch tools. Strong background in plasma physics.
Thin Film & Diffusion Engineers
Grow atomic-level layers of metals and dielectrics. You will manage high-temperature furnaces and vacuum chambers to deposit precise films critical for transistor performance.
Educational Background
M.Tech / B.Tech (Material Science, Metallurgy)
Minimum Qualifications
3-8 years operating CVD/PVD/ALD tools. Solid understanding of thermodynamics and solid-state physics.
NPI Engineer
Join our core packaging group as NPI Engineer to design, optimize, and scale advanced microelectronics assembly and wire bonding processes.
Educational Background
B.Tech / M.Tech in Materials Science, Electronics, or Mechanical Engineering
Minimum Qualifications
Experience in high-volume microelectronics assembly, process integration, and automated packaging.
Engineering Manager - FATP
Drive technology roadmap execution, process integration, and advanced device development as Engineering Manager - FATP across our fabrication nodes.
Educational Background
B.Tech / M.Tech in Microelectronics, Electrical Engineering, or Applied Physics
Minimum Qualifications
Strong background in semiconductor device physics, process node scaling, and cleanroom integration.
SMT Technician
Join our core packaging group as SMT Technician to design, optimize, and scale advanced microelectronics assembly and wire bonding processes.
Educational Background
B.Tech / M.Tech in Materials Science, Electronics, or Mechanical Engineering
Minimum Qualifications
Experience in high-volume microelectronics assembly, process integration, and automated packaging.
Test Development Engineer
Drive technology roadmap execution, process integration, and advanced device development as Test Development Engineer across our fabrication nodes.
Educational Background
B.Tech / M.Tech in Microelectronics, Electrical Engineering, or Applied Physics
Minimum Qualifications
Strong background in semiconductor device physics, process node scaling, and cleanroom integration.
Litho Process Engineer
Drive technology roadmap execution, process integration, and advanced device development as Litho Process Engineer across our fabrication nodes.
Educational Background
B.Tech / M.Tech in Microelectronics, Electrical Engineering, or Applied Physics
Minimum Qualifications
Strong background in semiconductor device physics, process node scaling, and cleanroom integration.
Process Engineer
Join our core packaging group as Process Engineer to design, optimize, and scale advanced microelectronics assembly and wire bonding processes.
Educational Background
B.Tech / M.Tech in Materials Science, Electronics, or Mechanical Engineering
Minimum Qualifications
Experience in high-volume microelectronics assembly, process integration, and automated packaging.
Lead _ Product Development
Drive technology roadmap execution, process integration, and advanced device development as Lead _ Product Development across our fabrication nodes.
Educational Background
B.Tech / M.Tech in Microelectronics, Electrical Engineering, or Applied Physics
Minimum Qualifications
Strong background in semiconductor device physics, process node scaling, and cleanroom integration.
Equipment Engineer
Join our core packaging group as Equipment Engineer to design, optimize, and scale advanced microelectronics assembly and wire bonding processes.
Educational Background
B.Tech / M.Tech in Materials Science, Electronics, or Mechanical Engineering
Minimum Qualifications
Experience in high-volume microelectronics assembly, process integration, and automated packaging.
Lead Mechanical Engineering
Drive technology roadmap execution, process integration, and advanced device development as Lead Mechanical Engineering across our fabrication nodes.
Educational Background
B.Tech / M.Tech in Microelectronics, Electrical Engineering, or Applied Physics
Minimum Qualifications
Strong background in semiconductor device physics, process node scaling, and cleanroom integration.
Technical Program Manager - Hardware Engineering
Drive technology roadmap execution, process integration, and advanced device development as Technical Program Manager - Hardware Engineering across our fabrication nodes.
Educational Background
B.Tech / M.Tech in Microelectronics, Electrical Engineering, or Applied Physics
Minimum Qualifications
Strong background in semiconductor device physics, process node scaling, and cleanroom integration.
RF Engineering
Drive technology roadmap execution, process integration, and advanced device development as RF Engineering across our fabrication nodes.
Educational Background
B.Tech / M.Tech in Microelectronics, Electrical Engineering, or Applied Physics
Minimum Qualifications
Strong background in semiconductor device physics, process node scaling, and cleanroom integration.
Equipment Engineer
Join our core packaging group as Equipment Engineer to design, optimize, and scale advanced microelectronics assembly and wire bonding processes.
Educational Background
B.Tech / M.Tech in Materials Science, Electronics, or Mechanical Engineering
Minimum Qualifications
Experience in high-volume microelectronics assembly, process integration, and automated packaging.
Process Engineer SME
Join our core packaging group as Process Engineer SME to design, optimize, and scale advanced microelectronics assembly and wire bonding processes.
Educational Background
B.Tech / M.Tech in Materials Science, Electronics, or Mechanical Engineering
Minimum Qualifications
Experience in high-volume microelectronics assembly, process integration, and automated packaging.
Wire bond Engineer
Join our core packaging group as Wire bond Engineer to design, optimize, and scale advanced microelectronics assembly and wire bonding processes.
Educational Background
B.Tech / M.Tech in Materials Science, Electronics, or Mechanical Engineering
Minimum Qualifications
Experience in high-volume microelectronics assembly, process integration, and automated packaging.
Wire bond Technician
Join our core packaging group as Wire bond Technician to design, optimize, and scale advanced microelectronics assembly and wire bonding processes.
Educational Background
B.Tech / M.Tech in Materials Science, Electronics, or Mechanical Engineering
Minimum Qualifications
Experience in high-volume microelectronics assembly, process integration, and automated packaging.
Flip Chip Engineers
Join our core packaging group as Flip Chip Engineers to design, optimize, and scale advanced microelectronics assembly and wire bonding processes.
Educational Background
B.Tech / M.Tech in Materials Science, Electronics, or Mechanical Engineering
Minimum Qualifications
Experience in high-volume microelectronics assembly, process integration, and automated packaging.
NPI Engineers
Join our core packaging group as NPI Engineers to design, optimize, and scale advanced microelectronics assembly and wire bonding processes.
Educational Background
B.Tech / M.Tech in Materials Science, Electronics, or Mechanical Engineering
Minimum Qualifications
Experience in high-volume microelectronics assembly, process integration, and automated packaging.
NPI Lead
Join our core packaging group as NPI Lead to design, optimize, and scale advanced microelectronics assembly and wire bonding processes.
Educational Background
B.Tech / M.Tech in Materials Science, Electronics, or Mechanical Engineering
Minimum Qualifications
Experience in high-volume microelectronics assembly, process integration, and automated packaging.
Process Engineering
Join our core packaging group as Process Engineering to design, optimize, and scale advanced microelectronics assembly and wire bonding processes.
Educational Background
B.Tech / M.Tech in Materials Science, Electronics, or Mechanical Engineering
Minimum Qualifications
Experience in high-volume microelectronics assembly, process integration, and automated packaging.
Process Engineering
Join our core packaging group as Process Engineering to design, optimize, and scale advanced microelectronics assembly and wire bonding processes.
Educational Background
B.Tech / M.Tech in Materials Science, Electronics, or Mechanical Engineering
Minimum Qualifications
Experience in high-volume microelectronics assembly, process integration, and automated packaging.
IC Senior Test Cell Development Manager
Drive technology roadmap execution, process integration, and advanced device development as IC Senior Test Cell Development Manager across our fabrication nodes.
Educational Background
B.Tech / M.Tech in Microelectronics, Electrical Engineering, or Applied Physics
Minimum Qualifications
Strong background in semiconductor device physics, process node scaling, and cleanroom integration.
IC Technology Development Program Manager
Drive technology roadmap execution, process integration, and advanced device development as IC Technology Development Program Manager across our fabrication nodes.
Educational Background
B.Tech / M.Tech in Microelectronics, Electrical Engineering, or Applied Physics
Minimum Qualifications
Strong background in semiconductor device physics, process node scaling, and cleanroom integration.
Process Die Preparation SME
Join our core packaging group as Process Die Preparation SME to design, optimize, and scale advanced microelectronics assembly and wire bonding processes.
Educational Background
B.Tech / M.Tech in Materials Science, Electronics, or Mechanical Engineering
Minimum Qualifications
Experience in high-volume microelectronics assembly, process integration, and automated packaging.
Senior Engineer_Engineering
Drive technology roadmap execution, process integration, and advanced device development as Senior Engineer_Engineering across our fabrication nodes.
Educational Background
B.Tech / M.Tech in Microelectronics, Electrical Engineering, or Applied Physics
Minimum Qualifications
Strong background in semiconductor device physics, process node scaling, and cleanroom integration.
NPI Technician
Join our core packaging group as NPI Technician to design, optimize, and scale advanced microelectronics assembly and wire bonding processes.
Educational Background
B.Tech / M.Tech in Materials Science, Electronics, or Mechanical Engineering
Minimum Qualifications
Experience in high-volume microelectronics assembly, process integration, and automated packaging.
NPI Technician
Join our core packaging group as NPI Technician to design, optimize, and scale advanced microelectronics assembly and wire bonding processes.
Educational Background
B.Tech / M.Tech in Materials Science, Electronics, or Mechanical Engineering
Minimum Qualifications
Experience in high-volume microelectronics assembly, process integration, and automated packaging.
NPI Technician
Join our core packaging group as NPI Technician to design, optimize, and scale advanced microelectronics assembly and wire bonding processes.
Educational Background
B.Tech / M.Tech in Materials Science, Electronics, or Mechanical Engineering
Minimum Qualifications
Experience in high-volume microelectronics assembly, process integration, and automated packaging.
PCBA Test Fixture & Robotic Automation Design Manager
Drive technology roadmap execution, process integration, and advanced device development as PCBA Test Fixture & Robotic Automation Design Manager across our fabrication nodes.
Educational Background
B.Tech / M.Tech in Microelectronics, Electrical Engineering, or Applied Physics
Minimum Qualifications
Strong background in semiconductor device physics, process node scaling, and cleanroom integration.
NPI / TD Package Development & Assembly Process Engineering
Join our core packaging group as NPI / TD Package Development & Assembly Process Engineering to design, optimize, and scale advanced microelectronics assembly and wire bonding processes.
Educational Background
B.Tech / M.Tech in Materials Science, Electronics, or Mechanical Engineering
Minimum Qualifications
Experience in high-volume microelectronics assembly, process integration, and automated packaging.
IC Test Process/ Test Cell Development Manager
Drive technology roadmap execution, process integration, and advanced device development as IC Test Process/ Test Cell Development Manager across our fabrication nodes.
Educational Background
B.Tech / M.Tech in Microelectronics, Electrical Engineering, or Applied Physics
Minimum Qualifications
Strong background in semiconductor device physics, process node scaling, and cleanroom integration.
Test Product Engineer
Drive technology roadmap execution, process integration, and advanced device development as Test Product Engineer across our fabrication nodes.
Educational Background
B.Tech / M.Tech in Microelectronics, Electrical Engineering, or Applied Physics
Minimum Qualifications
Strong background in semiconductor device physics, process node scaling, and cleanroom integration.
Test Development Engineer
Drive technology roadmap execution, process integration, and advanced device development as Test Development Engineer across our fabrication nodes.
Educational Background
B.Tech / M.Tech in Microelectronics, Electrical Engineering, or Applied Physics
Minimum Qualifications
Strong background in semiconductor device physics, process node scaling, and cleanroom integration.
NPI / TD Package Development & Assembly Process Engineering
Join our core packaging group as NPI / TD Package Development & Assembly Process Engineering to design, optimize, and scale advanced microelectronics assembly and wire bonding processes.
Educational Background
B.Tech / M.Tech in Materials Science, Electronics, or Mechanical Engineering
Minimum Qualifications
Experience in high-volume microelectronics assembly, process integration, and automated packaging.
NPI / TD Package Development & Assembly Process Engineering
Join our core packaging group as NPI / TD Package Development & Assembly Process Engineering to design, optimize, and scale advanced microelectronics assembly and wire bonding processes.
Educational Background
B.Tech / M.Tech in Materials Science, Electronics, or Mechanical Engineering
Minimum Qualifications
Experience in high-volume microelectronics assembly, process integration, and automated packaging.
Test Manager
Drive technology roadmap execution, process integration, and advanced device development as Test Manager across our fabrication nodes.
Educational Background
B.Tech / M.Tech in Microelectronics, Electrical Engineering, or Applied Physics
Minimum Qualifications
Strong background in semiconductor device physics, process node scaling, and cleanroom integration.
Test Product Engineer
Drive technology roadmap execution, process integration, and advanced device development as Test Product Engineer across our fabrication nodes.
Educational Background
B.Tech / M.Tech in Microelectronics, Electrical Engineering, or Applied Physics
Minimum Qualifications
Strong background in semiconductor device physics, process node scaling, and cleanroom integration.
Test Development Engineer
Drive technology roadmap execution, process integration, and advanced device development as Test Development Engineer across our fabrication nodes.
Educational Background
B.Tech / M.Tech in Microelectronics, Electrical Engineering, or Applied Physics
Minimum Qualifications
Strong background in semiconductor device physics, process node scaling, and cleanroom integration.
IC Senior Test Cell Development Engineer
Drive technology roadmap execution, process integration, and advanced device development as IC Senior Test Cell Development Engineer across our fabrication nodes.
Educational Background
B.Tech / M.Tech in Microelectronics, Electrical Engineering, or Applied Physics
Minimum Qualifications
Strong background in semiconductor device physics, process node scaling, and cleanroom integration.
Wirebond Process Engineering Lead
Join our core packaging group as Wirebond Process Engineering Lead to design, optimize, and scale advanced microelectronics assembly and wire bonding processes.
Educational Background
B.Tech / M.Tech in Materials Science, Electronics, or Mechanical Engineering
Minimum Qualifications
Experience in high-volume microelectronics assembly, process integration, and automated packaging.
Program Manager
Join our core packaging group as Program Manager to design, optimize, and scale advanced microelectronics assembly and wire bonding processes.
Educational Background
B.Tech / M.Tech in Materials Science, Electronics, or Mechanical Engineering
Minimum Qualifications
Experience in high-volume microelectronics assembly, process integration, and automated packaging.
TD EOL Process engineer
Join our core packaging group as TD EOL Process engineer to design, optimize, and scale advanced microelectronics assembly and wire bonding processes.
Educational Background
B.Tech / M.Tech in Materials Science, Electronics, or Mechanical Engineering
Minimum Qualifications
Experience in high-volume microelectronics assembly, process integration, and automated packaging.
Test Development Senior Engineer
Drive technology roadmap execution, process integration, and advanced device development as Test Development Senior Engineer across our fabrication nodes.
Educational Background
B.Tech / M.Tech in Microelectronics, Electrical Engineering, or Applied Physics
Minimum Qualifications
Strong background in semiconductor device physics, process node scaling, and cleanroom integration.
Flipchip Engineer
Join our core packaging group as Flipchip Engineer to design, optimize, and scale advanced microelectronics assembly and wire bonding processes.
Educational Background
B.Tech / M.Tech in Materials Science, Electronics, or Mechanical Engineering
Minimum Qualifications
Experience in high-volume microelectronics assembly, process integration, and automated packaging.
NPI / TD Package Development & Assembly Process Engineering
Join our core packaging group as NPI / TD Package Development & Assembly Process Engineering to design, optimize, and scale advanced microelectronics assembly and wire bonding processes.
Educational Background
B.Tech / M.Tech in Materials Science, Electronics, or Mechanical Engineering
Minimum Qualifications
Experience in high-volume microelectronics assembly, process integration, and automated packaging.
Test Development Engineer
Drive technology roadmap execution, process integration, and advanced device development as Test Development Engineer across our fabrication nodes.
Educational Background
B.Tech / M.Tech in Microelectronics, Electrical Engineering, or Applied Physics
Minimum Qualifications
Strong background in semiconductor device physics, process node scaling, and cleanroom integration.
Process Engineering SME
Join our core packaging group as Process Engineering SME to design, optimize, and scale advanced microelectronics assembly and wire bonding processes.
Educational Background
B.Tech / M.Tech in Materials Science, Electronics, or Mechanical Engineering
Minimum Qualifications
Experience in high-volume microelectronics assembly, process integration, and automated packaging.
Mask Quality Lead
Drive technology roadmap execution, process integration, and advanced device development as Mask Quality Lead across our fabrication nodes.
Educational Background
B.Tech / M.Tech in Microelectronics, Electrical Engineering, or Applied Physics
Minimum Qualifications
Strong background in semiconductor device physics, process node scaling, and cleanroom integration.
SRAM Engineer
Drive technology roadmap execution, process integration, and advanced device development as SRAM Engineer across our fabrication nodes.
Educational Background
B.Tech / M.Tech in Microelectronics, Electrical Engineering, or Applied Physics
Minimum Qualifications
Strong background in semiconductor device physics, process node scaling, and cleanroom integration.
Metrology Engineer
Looking for a skilled Metrology Engineer to join our fast-growing division. You will work on state-of-the-art semiconductor systems, collaborate with cross-functional teams, and contribute to cutting-edge technology development.
Educational Background
B.Tech / M.Tech in Electronics, Mechanical, or Computer Science Engineering
Minimum Qualifications
2+ years of relevant experience in high-tech manufacturing, assembly, or product engineering.
Data Handling Lead
Drive technology roadmap execution, process integration, and advanced device development as Data Handling Lead across our fabrication nodes.
Educational Background
B.Tech / M.Tech in Microelectronics, Electrical Engineering, or Applied Physics
Minimum Qualifications
Strong background in semiconductor device physics, process node scaling, and cleanroom integration.
Tape Out Handling Lead
Drive technology roadmap execution, process integration, and advanced device development as Tape Out Handling Lead across our fabrication nodes.
Educational Background
B.Tech / M.Tech in Microelectronics, Electrical Engineering, or Applied Physics
Minimum Qualifications
Strong background in semiconductor device physics, process node scaling, and cleanroom integration.
Frame Making Lead
Drive technology roadmap execution, process integration, and advanced device development as Frame Making Lead across our fabrication nodes.
Educational Background
B.Tech / M.Tech in Microelectronics, Electrical Engineering, or Applied Physics
Minimum Qualifications
Strong background in semiconductor device physics, process node scaling, and cleanroom integration.
Equipment Engineer
Join our core packaging group as Equipment Engineer to design, optimize, and scale advanced microelectronics assembly and wire bonding processes.
Educational Background
B.Tech / M.Tech in Materials Science, Electronics, or Mechanical Engineering
Minimum Qualifications
Experience in high-volume microelectronics assembly, process integration, and automated packaging.
ISP Test Product Engineer
Drive technology roadmap execution, process integration, and advanced device development as ISP Test Product Engineer across our fabrication nodes.
Educational Background
B.Tech / M.Tech in Microelectronics, Electrical Engineering, or Applied Physics
Minimum Qualifications
Strong background in semiconductor device physics, process node scaling, and cleanroom integration.
IC Technology Development IP & Patent Manager
Join our core packaging group as IC Technology Development IP & Patent Manager to design, optimize, and scale advanced microelectronics assembly and wire bonding processes.
Educational Background
B.Tech / M.Tech in Materials Science, Electronics, or Mechanical Engineering
Minimum Qualifications
Experience in high-volume microelectronics assembly, process integration, and automated packaging.
IC Technology Development - Mold Process Engineer
Join our core packaging group as IC Technology Development - Mold Process Engineer to design, optimize, and scale advanced microelectronics assembly and wire bonding processes.
Educational Background
B.Tech / M.Tech in Materials Science, Electronics, or Mechanical Engineering
Minimum Qualifications
Experience in high-volume microelectronics assembly, process integration, and automated packaging.
IC Technology Development - Process & Packaging SME
Join our core packaging group as IC Technology Development - Process & Packaging SME to design, optimize, and scale advanced microelectronics assembly and wire bonding processes.
Educational Background
B.Tech / M.Tech in Materials Science, Electronics, or Mechanical Engineering
Minimum Qualifications
Experience in high-volume microelectronics assembly, process integration, and automated packaging.
Automation Engineer - FATP
Drive technology roadmap execution, process integration, and advanced device development as Automation Engineer - FATP across our fabrication nodes.
Educational Background
B.Tech / M.Tech in Microelectronics, Electrical Engineering, or Applied Physics
Minimum Qualifications
Strong background in semiconductor device physics, process node scaling, and cleanroom integration.
IC Technology Development QA & FA Reliability Engineer
Join our core packaging group as IC Technology Development QA & FA Reliability Engineer to design, optimize, and scale advanced microelectronics assembly and wire bonding processes.
Educational Background
B.Tech / M.Tech in Materials Science, Electronics, or Mechanical Engineering
Minimum Qualifications
Experience in high-volume microelectronics assembly, process integration, and automated packaging.
IC Technology Development Equipment Sourcing Engineer
Join our core packaging group as IC Technology Development Equipment Sourcing Engineer to design, optimize, and scale advanced microelectronics assembly and wire bonding processes.
Educational Background
B.Tech / M.Tech in Materials Science, Electronics, or Mechanical Engineering
Minimum Qualifications
Experience in high-volume microelectronics assembly, process integration, and automated packaging.
IC Technology Development - Wire bond Process SME
Join our core packaging group as IC Technology Development - Wire bond Process SME to design, optimize, and scale advanced microelectronics assembly and wire bonding processes.
Educational Background
B.Tech / M.Tech in Materials Science, Electronics, or Mechanical Engineering
Minimum Qualifications
Experience in high-volume microelectronics assembly, process integration, and automated packaging.
IC Technology Development Tooling design Manager
Join our core packaging group as IC Technology Development Tooling design Manager to design, optimize, and scale advanced microelectronics assembly and wire bonding processes.
Educational Background
B.Tech / M.Tech in Materials Science, Electronics, or Mechanical Engineering
Minimum Qualifications
Experience in high-volume microelectronics assembly, process integration, and automated packaging.
IC Technology Development Lead Frame/substrate design Manager
Join our core packaging group as IC Technology Development Lead Frame/substrate design Manager to design, optimize, and scale advanced microelectronics assembly and wire bonding processes.
Educational Background
B.Tech / M.Tech in Materials Science, Electronics, or Mechanical Engineering
Minimum Qualifications
Experience in high-volume microelectronics assembly, process integration, and automated packaging.
3Equipment Engineering & Maintenance
This team ensures the multi-million-dollar tools in the cleanroom and sub-fab operate with near-zero downtime. They handle the robotics, vacuums, and mechanical calibrations.
Equipment Engineering Lead
Lead a massive team of technicians to ensure 99.9% uptime of ultra-complex manufacturing tools. You will schedule preventative maintenance, manage spare parts inventory, and liaise directly with OEMs.
Educational Background
B.Tech (Mechanical / Mechatronics / EE)
Minimum Qualifications
12+ years maintaining semiconductor tools. Deep mechanical and electrical troubleshooting skills.
Automation / OHT Engineers
Maintain the robotic highway spanning the fab ceiling. You will program and repair the Overhead Hoist Transports (OHT) that move FOUPs (wafer pods) automatically between machines.
Educational Background
B.Tech (Robotics, Mechatronics, CS)
Minimum Qualifications
5+ years in industrial robotics or AMHS. Knowledge of SECS/GEM protocols is a major plus.
Tool Maintenance Technicians
Perform daily hands-on maintenance inside the cleanroom. You will rebuild turbo-molecular vacuum pumps, calibrate robotic arms, and clean plasma chamber components.
Educational Background
Diploma / ITI (Mechanical, Electrical, Electronics)
Minimum Qualifications
3-5 years hands-on mechanical/electrical repair experience, preferably in a cleanroom or high-tech environment.
Sub-Fab Technicians
Work directly below the cleanroom in the sub-fab. You will manage the secure delivery of highly toxic and reactive precursor gases, as well as the localized scrubbers that neutralize them post-process.
Educational Background
Diploma / ITI (Chemical, Instrumentation)
Minimum Qualifications
3-5 years handling hazardous chemicals/gases. Strict adherence to safety protocols (Hazmat).
Manufacturing Systems Engineer
Manage high-volume wafer fabrication schedules, automated material handling, and cleanroom throughput optimization as Manufacturing Systems Engineer.
Educational Background
B.Tech in Mechatronics, Industrial Engineering, or Electronics
Minimum Qualifications
Experience in automated factory operations, cycle-time optimization, and cleanroom protocol management.
Equipment Technician
Manage high-volume wafer fabrication schedules, automated material handling, and cleanroom throughput optimization as Equipment Technician.
Educational Background
B.Tech in Mechatronics, Industrial Engineering, or Electronics
Minimum Qualifications
Experience in automated factory operations, cycle-time optimization, and cleanroom protocol management.
Manufacturing Readiness Program Manager
Manage high-volume wafer fabrication schedules, automated material handling, and cleanroom throughput optimization as Manufacturing Readiness Program Manager.
Educational Background
B.Tech in Mechatronics, Industrial Engineering, or Electronics
Minimum Qualifications
Experience in automated factory operations, cycle-time optimization, and cleanroom protocol management.
Equipment Technician
Manage high-volume wafer fabrication schedules, automated material handling, and cleanroom throughput optimization as Equipment Technician.
Educational Background
B.Tech in Mechatronics, Industrial Engineering, or Electronics
Minimum Qualifications
Experience in automated factory operations, cycle-time optimization, and cleanroom protocol management.
Production Shift Manager
Manage high-volume wafer fabrication schedules, automated material handling, and cleanroom throughput optimization as Production Shift Manager.
Educational Background
B.Tech in Mechatronics, Industrial Engineering, or Electronics
Minimum Qualifications
Experience in automated factory operations, cycle-time optimization, and cleanroom protocol management.
Production Engineer
Manage high-volume wafer fabrication schedules, automated material handling, and cleanroom throughput optimization as Production Engineer.
Educational Background
B.Tech in Mechatronics, Industrial Engineering, or Electronics
Minimum Qualifications
Experience in automated factory operations, cycle-time optimization, and cleanroom protocol management.
Production Engineer
Manage high-volume wafer fabrication schedules, automated material handling, and cleanroom throughput optimization as Production Engineer.
Educational Background
B.Tech in Mechatronics, Industrial Engineering, or Electronics
Minimum Qualifications
Experience in automated factory operations, cycle-time optimization, and cleanroom protocol management.
SMT Equipment Technician
Manage high-volume wafer fabrication schedules, automated material handling, and cleanroom throughput optimization as SMT Equipment Technician.
Educational Background
B.Tech in Mechatronics, Industrial Engineering, or Electronics
Minimum Qualifications
Experience in automated factory operations, cycle-time optimization, and cleanroom protocol management.
SMT Equipment Technician
Manage high-volume wafer fabrication schedules, automated material handling, and cleanroom throughput optimization as SMT Equipment Technician.
Educational Background
B.Tech in Mechatronics, Industrial Engineering, or Electronics
Minimum Qualifications
Experience in automated factory operations, cycle-time optimization, and cleanroom protocol management.
Test Debug Engineer
Manage high-volume wafer fabrication schedules, automated material handling, and cleanroom throughput optimization as Test Debug Engineer.
Educational Background
B.Tech in Mechatronics, Industrial Engineering, or Electronics
Minimum Qualifications
Experience in automated factory operations, cycle-time optimization, and cleanroom protocol management.
TLA Technician
Manage high-volume wafer fabrication schedules, automated material handling, and cleanroom throughput optimization as TLA Technician.
Educational Background
B.Tech in Mechatronics, Industrial Engineering, or Electronics
Minimum Qualifications
Experience in automated factory operations, cycle-time optimization, and cleanroom protocol management.
Test Equipment Manager
Manage high-volume wafer fabrication schedules, automated material handling, and cleanroom throughput optimization as Test Equipment Manager.
Educational Background
B.Tech in Mechatronics, Industrial Engineering, or Electronics
Minimum Qualifications
Experience in automated factory operations, cycle-time optimization, and cleanroom protocol management.
Data Analyst
Manage high-volume wafer fabrication schedules, automated material handling, and cleanroom throughput optimization as Data Analyst.
Educational Background
B.Tech in Mechatronics, Industrial Engineering, or Electronics
Minimum Qualifications
Experience in automated factory operations, cycle-time optimization, and cleanroom protocol management.
Industrial Engineer
Manage high-volume wafer fabrication schedules, automated material handling, and cleanroom throughput optimization as Industrial Engineer.
Educational Background
B.Tech in Mechatronics, Industrial Engineering, or Electronics
Minimum Qualifications
Experience in automated factory operations, cycle-time optimization, and cleanroom protocol management.
Production Manager
Manage high-volume wafer fabrication schedules, automated material handling, and cleanroom throughput optimization as Production Manager.
Educational Background
B.Tech in Mechatronics, Industrial Engineering, or Electronics
Minimum Qualifications
Experience in automated factory operations, cycle-time optimization, and cleanroom protocol management.
TLA Development Engineer
Manage high-volume wafer fabrication schedules, automated material handling, and cleanroom throughput optimization as TLA Development Engineer.
Educational Background
B.Tech in Mechatronics, Industrial Engineering, or Electronics
Minimum Qualifications
Experience in automated factory operations, cycle-time optimization, and cleanroom protocol management.
Tooling Technician
Manage high-volume wafer fabrication schedules, automated material handling, and cleanroom throughput optimization as Tooling Technician.
Educational Background
B.Tech in Mechatronics, Industrial Engineering, or Electronics
Minimum Qualifications
Experience in automated factory operations, cycle-time optimization, and cleanroom protocol management.
TLA Equipment Technician
Manage high-volume wafer fabrication schedules, automated material handling, and cleanroom throughput optimization as TLA Equipment Technician.
Educational Background
B.Tech in Mechatronics, Industrial Engineering, or Electronics
Minimum Qualifications
Experience in automated factory operations, cycle-time optimization, and cleanroom protocol management.
SMT Equipment Technician
Manage high-volume wafer fabrication schedules, automated material handling, and cleanroom throughput optimization as SMT Equipment Technician.
Educational Background
B.Tech in Mechatronics, Industrial Engineering, or Electronics
Minimum Qualifications
Experience in automated factory operations, cycle-time optimization, and cleanroom protocol management.
Equipment Technician
Manage high-volume wafer fabrication schedules, automated material handling, and cleanroom throughput optimization as Equipment Technician.
Educational Background
B.Tech in Mechatronics, Industrial Engineering, or Electronics
Minimum Qualifications
Experience in automated factory operations, cycle-time optimization, and cleanroom protocol management.
Test Equipment Manager
Manage high-volume wafer fabrication schedules, automated material handling, and cleanroom throughput optimization as Test Equipment Manager.
Educational Background
B.Tech in Mechatronics, Industrial Engineering, or Electronics
Minimum Qualifications
Experience in automated factory operations, cycle-time optimization, and cleanroom protocol management.
ISP Shift Operator Supervisor
Manage high-volume wafer fabrication schedules, automated material handling, and cleanroom throughput optimization as ISP Shift Operator Supervisor.
Educational Background
B.Tech in Mechatronics, Industrial Engineering, or Electronics
Minimum Qualifications
Experience in automated factory operations, cycle-time optimization, and cleanroom protocol management.
4Yield, Metrology, and Quality Assurance
This department acts as the fab's police force. They use electron microscopes and statistical models to find defects and ensure the silicon meets exact electrical specifications.
Yield Enhancement Director
Direct the fab's most critical financial metric: Yield. You will combine big data from metrology tools to identify root causes of wafer defects and drive continuous process improvements.
Educational Background
Ph.D. / M.Tech (Data Science, EE, Physics)
Minimum Qualifications
10+ years in yield enhancement. Strong mastery of SPC, DOE (Design of Experiments), and data analytics.
Metrology Engineers
Measure nanoscale features to ensure physical dimensions perfectly match the blueprint. You will operate CD-SEMs, ellipsometers, and acoustic microscopes.
Educational Background
M.Tech / B.Tech (Optics, Physics, Electronics)
Minimum Qualifications
3-8 years hands-on metrology experience. Deep knowledge of electron microscopy and optics.
Failure Analysis (FA) Engineers
Autopsy failed microchips. You will use Focused Ion Beams (FIB) to slice chips open, run X-Ray spectroscopy to find contaminants, and physically probe nanometer-wide circuits to find electrical shorts.
Educational Background
M.Tech / B.Tech (Material Science, EE)
Minimum Qualifications
5+ years in Failure Analysis. Mastery of FIB, TEM, and SEM tools.
Reliability Test Engineers
Ensure our chips survive decades of use. You will run high-temperature burn-in tests, thermal cycling, and voltage stress tests to guarantee chips meet AEC-Q100 automotive standards.
Educational Background
B.Tech (Electronics, Electrical)
Minimum Qualifications
3-7 years in reliability testing. Strong knowledge of JEDEC and AEC-Q100 standards.
Chemical Lab Failure Analysis Engineer
Perform advanced failure analysis, physical characterization, and material diagnostics as Chemical Lab Failure Analysis Engineer using electron microscopy and spectroscopy tools.
Educational Background
M.Sc / M.Tech in Materials Characterization, Physics, or Nanotechnology
Minimum Qualifications
Hands-on experience with focused ion beam (FIB) milling, TEM, SEM, or mass spectrometry tools.
Equipment Engineer
Perform advanced failure analysis, physical characterization, and material diagnostics as Equipment Engineer using electron microscopy and spectroscopy tools.
Educational Background
M.Sc / M.Tech in Materials Characterization, Physics, or Nanotechnology
Minimum Qualifications
Hands-on experience with focused ion beam (FIB) milling, TEM, SEM, or mass spectrometry tools.
Low Yield Analysis
Perform advanced failure analysis, physical characterization, and material diagnostics as Low Yield Analysis using electron microscopy and spectroscopy tools.
Educational Background
M.Sc / M.Tech in Materials Characterization, Physics, or Nanotechnology
Minimum Qualifications
Hands-on experience with focused ion beam (FIB) milling, TEM, SEM, or mass spectrometry tools.
TOF SIMS Engineer
Perform advanced failure analysis, physical characterization, and material diagnostics as TOF SIMS Engineer using electron microscopy and spectroscopy tools.
Educational Background
M.Sc / M.Tech in Materials Characterization, Physics, or Nanotechnology
Minimum Qualifications
Hands-on experience with focused ion beam (FIB) milling, TEM, SEM, or mass spectrometry tools.
Physical Failure Analysis Lab Manager
Perform advanced failure analysis, physical characterization, and material diagnostics as Physical Failure Analysis Lab Manager using electron microscopy and spectroscopy tools.
Educational Background
M.Sc / M.Tech in Materials Characterization, Physics, or Nanotechnology
Minimum Qualifications
Hands-on experience with focused ion beam (FIB) milling, TEM, SEM, or mass spectrometry tools.
Supplier Quality Engineer
Implement statistical process control (SPC) and quality management systems as Supplier Quality Engineer to guarantee automotive-grade defect rates.
Educational Background
B.Tech in Quality Engineering, Electronics, or Industrial Engineering
Minimum Qualifications
Familiarity with IATF 16949, AEC-Q100 standards, and structured root-cause analysis methodologies.
ISP Customer Quality Engineer
Implement statistical process control (SPC) and quality management systems as ISP Customer Quality Engineer to guarantee automotive-grade defect rates.
Educational Background
B.Tech in Quality Engineering, Electronics, or Industrial Engineering
Minimum Qualifications
Familiarity with IATF 16949, AEC-Q100 standards, and structured root-cause analysis methodologies.
QMS Engineer
Implement statistical process control (SPC) and quality management systems as QMS Engineer to guarantee automotive-grade defect rates.
Educational Background
B.Tech in Quality Engineering, Electronics, or Industrial Engineering
Minimum Qualifications
Familiarity with IATF 16949, AEC-Q100 standards, and structured root-cause analysis methodologies.
ESD Engineer
Implement statistical process control (SPC) and quality management systems as ESD Engineer to guarantee automotive-grade defect rates.
Educational Background
B.Tech in Quality Engineering, Electronics, or Industrial Engineering
Minimum Qualifications
Familiarity with IATF 16949, AEC-Q100 standards, and structured root-cause analysis methodologies.
Line Quality Technician
Implement statistical process control (SPC) and quality management systems as Line Quality Technician to guarantee automotive-grade defect rates.
Educational Background
B.Tech in Quality Engineering, Electronics, or Industrial Engineering
Minimum Qualifications
Familiarity with IATF 16949, AEC-Q100 standards, and structured root-cause analysis methodologies.
Quality Engineer
Implement statistical process control (SPC) and quality management systems as Quality Engineer to guarantee automotive-grade defect rates.
Educational Background
B.Tech in Quality Engineering, Electronics, or Industrial Engineering
Minimum Qualifications
Familiarity with IATF 16949, AEC-Q100 standards, and structured root-cause analysis methodologies.
Line Quality Technician
Implement statistical process control (SPC) and quality management systems as Line Quality Technician to guarantee automotive-grade defect rates.
Educational Background
B.Tech in Quality Engineering, Electronics, or Industrial Engineering
Minimum Qualifications
Familiarity with IATF 16949, AEC-Q100 standards, and structured root-cause analysis methodologies.
SPC Engineer
Implement statistical process control (SPC) and quality management systems as SPC Engineer to guarantee automotive-grade defect rates.
Educational Background
B.Tech in Quality Engineering, Electronics, or Industrial Engineering
Minimum Qualifications
Familiarity with IATF 16949, AEC-Q100 standards, and structured root-cause analysis methodologies.
SPC Engineer
Implement statistical process control (SPC) and quality management systems as SPC Engineer to guarantee automotive-grade defect rates.
Educational Background
B.Tech in Quality Engineering, Electronics, or Industrial Engineering
Minimum Qualifications
Familiarity with IATF 16949, AEC-Q100 standards, and structured root-cause analysis methodologies.
Customer Quality Engineer
Implement statistical process control (SPC) and quality management systems as Customer Quality Engineer to guarantee automotive-grade defect rates.
Educational Background
B.Tech in Quality Engineering, Electronics, or Industrial Engineering
Minimum Qualifications
Familiarity with IATF 16949, AEC-Q100 standards, and structured root-cause analysis methodologies.
Line Quality Technician
Implement statistical process control (SPC) and quality management systems as Line Quality Technician to guarantee automotive-grade defect rates.
Educational Background
B.Tech in Quality Engineering, Electronics, or Industrial Engineering
Minimum Qualifications
Familiarity with IATF 16949, AEC-Q100 standards, and structured root-cause analysis methodologies.
QMS Engineer
Implement statistical process control (SPC) and quality management systems as QMS Engineer to guarantee automotive-grade defect rates.
Educational Background
B.Tech in Quality Engineering, Electronics, or Industrial Engineering
Minimum Qualifications
Familiarity with IATF 16949, AEC-Q100 standards, and structured root-cause analysis methodologies.
Customer Quality Engineer
Implement statistical process control (SPC) and quality management systems as Customer Quality Engineer to guarantee automotive-grade defect rates.
Educational Background
B.Tech in Quality Engineering, Electronics, or Industrial Engineering
Minimum Qualifications
Familiarity with IATF 16949, AEC-Q100 standards, and structured root-cause analysis methodologies.
QA Test Engineer
Implement statistical process control (SPC) and quality management systems as QA Test Engineer to guarantee automotive-grade defect rates.
Educational Background
B.Tech in Quality Engineering, Electronics, or Industrial Engineering
Minimum Qualifications
Familiarity with IATF 16949, AEC-Q100 standards, and structured root-cause analysis methodologies.
Engineer I
Implement statistical process control (SPC) and quality management systems as Engineer I to guarantee automotive-grade defect rates.
Educational Background
B.Tech in Quality Engineering, Electronics, or Industrial Engineering
Minimum Qualifications
Familiarity with IATF 16949, AEC-Q100 standards, and structured root-cause analysis methodologies.
SQE Technician
Implement statistical process control (SPC) and quality management systems as SQE Technician to guarantee automotive-grade defect rates.
Educational Background
B.Tech in Quality Engineering, Electronics, or Industrial Engineering
Minimum Qualifications
Familiarity with IATF 16949, AEC-Q100 standards, and structured root-cause analysis methodologies.
Document Control Center
Implement statistical process control (SPC) and quality management systems as Document Control Center to guarantee automotive-grade defect rates.
Educational Background
B.Tech in Quality Engineering, Electronics, or Industrial Engineering
Minimum Qualifications
Familiarity with IATF 16949, AEC-Q100 standards, and structured root-cause analysis methodologies.
QMS
Implement statistical process control (SPC) and quality management systems as QMS to guarantee automotive-grade defect rates.
Educational Background
B.Tech in Quality Engineering, Electronics, or Industrial Engineering
Minimum Qualifications
Familiarity with IATF 16949, AEC-Q100 standards, and structured root-cause analysis methodologies.
5Facilities & Ultra-Pure Utilities
Semiconductor fabs require massive, un-interrupted industrial inputs. This team manages the water, power, and environmental systems outside the cleanroom.
Facilities Director
Manage the lifeblood of the 7-acre campus. You are responsible for ensuring 100% uptime of massive power grids, HVAC systems, and water treatment plants that feed the fab.
Educational Background
B.Tech (Mechanical / Civil / Electrical)
Minimum Qualifications
15+ years managing critical, high-uptime industrial facilities. Semiconductor or pharma facility experience preferred.
Ultra-Pure Water (UPW) Engineers
Produce the purest water on earth. You will manage complex reverse osmosis, electro-deionization (EDI), and UV treatment plants to deliver 18.2 MΩ·cm water to the cleanroom.
Educational Background
B.Tech (Chemical Eng, Environmental Eng)
Minimum Qualifications
5+ years operating advanced water purification systems. Strong understanding of fluid dynamics and chemistry.
HVAC & Cleanroom Engineers
Control the weather inside the factory. You will manage massive chiller units and maintain rigid temperature, humidity, and positive-pressure cleanroom cascading using HEPA/ULPA filters.
Educational Background
B.Tech (Mechanical Engineering)
Minimum Qualifications
5+ years managing critical HVAC systems. Cleanroom HVAC certification is a major advantage.
High-Voltage Power Engineers
Ensure the fab never loses power. A millisecond outage can ruin millions of dollars of silicon. You will manage a 132kV substation, massive diesel generators, and dynamic rotary UPS systems.
Educational Background
B.Tech (Electrical Engineering)
Minimum Qualifications
5+ years managing high-voltage substations and heavy industrial UPS systems.
Lead - UPW/WWTP
Lead complex engineering project execution, facilities deployment, and tooling hookup schedules for the fabrication facilities as Lead - UPW/WWTP.
Educational Background
B.Tech in Mechanical, Electrical, or Civil Engineering
Minimum Qualifications
Project management experience in high-CAPEX industrial construction, cleanroom hookup, or utility routing.
Tool Hook Design Manager
Lead complex engineering project execution, facilities deployment, and tooling hookup schedules for the fabrication facilities as Tool Hook Design Manager.
Educational Background
B.Tech in Mechanical, Electrical, or Civil Engineering
Minimum Qualifications
Project management experience in high-CAPEX industrial construction, cleanroom hookup, or utility routing.
Lead - Chemical (Projects)
Lead complex engineering project execution, facilities deployment, and tooling hookup schedules for the fabrication facilities as Lead - Chemical (Projects).
Educational Background
B.Tech in Mechanical, Electrical, or Civil Engineering
Minimum Qualifications
Project management experience in high-CAPEX industrial construction, cleanroom hookup, or utility routing.
Electrical - SCADA (Projects)
Lead complex engineering project execution, facilities deployment, and tooling hookup schedules for the fabrication facilities as Electrical - SCADA (Projects).
Educational Background
B.Tech in Mechanical, Electrical, or Civil Engineering
Minimum Qualifications
Project management experience in high-CAPEX industrial construction, cleanroom hookup, or utility routing.
6Advanced Packaging & PCBA (Building 3)
This department takes the finished, sliced silicon dies and mounts them onto circuit boards for final consumer/industrial use.
SMT Line Managers
Lead the PCBA assembly floor. You will optimize the speed and accuracy of high-speed pick-and-place machines and tune solder reflow oven profiles to minimize defects.
Educational Background
B.Tech (Industrial, Electronics, Mechanical)
Minimum Qualifications
8+ years running high-volume SMT manufacturing lines. Lean Six Sigma certification preferred.
Packaging R&D Engineers
Design the physical package that protects the silicon. You will engineer thermal dissipation pathways, wire bonding layouts, and flip-chip bump metallurgy.
Educational Background
M.Tech / B.Tech (Material Science, EE)
Minimum Qualifications
5+ years in semiconductor packaging (OSAT experience). Strong understanding of thermal and mechanical stress.
AOI / X-Ray Inspectors
Ensure perfect solder joints. You will program and monitor Automated Optical Inspection (AOI) tools and use 3D X-Ray machines to look for microscopic voids under BGA chips.
Educational Background
Diploma (Electronics / Quality Control)
Minimum Qualifications
2+ years operating AOI/X-Ray equipment in an electronics manufacturing environment.
7Environment, Health, and Safety (EHS)
Handling toxic gases (like Arsine) and hydrofluoric acid requires an uncompromising safety department.
EHS Director
Lead a culture of absolute safety. You will ensure the campus complies with all state and federal environmental laws, run emergency drills, and manage the overall safety protocols of the site.
Educational Background
B.Tech (Environmental Eng) + NEBOSH Diploma
Minimum Qualifications
12+ years leading EHS in chemical, pharma, or semiconductor industries. Deep knowledge of Indian environmental regulations.
Toxic Gas / Chemical Safety Officers
Monitor and respond to chemical hazards. You will manage the gas detection systems (e.g., toxic gas sniffers) and lead the emergency response team for any chemical leaks.
Educational Background
B.Tech / B.Sc (Chemistry, Chemical Eng)
Minimum Qualifications
5+ years in hazardous chemical safety. Hazmat response training and SCBA proficiency are mandatory.
Effluent Treatment (ETP) Operators
Ensure zero harmful discharge. You will operate the massive chemical neutralization plant, safely treating acidic/alkaline waste and heavy metals before any water leaves the facility.
Educational Background
Diploma (Chemical, Environmental)
Minimum Qualifications
3+ years operating industrial ETPs. Must understand acid neutralization and slurry filtration.
Product Owner - GenAI Manufacturing
Architect and implement enterprise cloud systems, MES automation, data lakes, and AI pipelines as Product Owner - GenAI Manufacturing to digitize factory floor operations.
Educational Background
B.Tech / M.Tech in Computer Science, Software Engineering, or Information Systems
Minimum Qualifications
Proficiency in enterprise software architecture, cloud platforms (AWS/GCP), and factory-floor systems automation.
Core Platform Lead
Architect and implement enterprise cloud systems, MES automation, data lakes, and AI pipelines as Core Platform Lead to digitize factory floor operations.
Educational Background
B.Tech / M.Tech in Computer Science, Software Engineering, or Information Systems
Minimum Qualifications
Proficiency in enterprise software architecture, cloud platforms (AWS/GCP), and factory-floor systems automation.
Data Lead
Architect and implement enterprise cloud systems, MES automation, data lakes, and AI pipelines as Data Lead to digitize factory floor operations.
Educational Background
B.Tech / M.Tech in Computer Science, Software Engineering, or Information Systems
Minimum Qualifications
Proficiency in enterprise software architecture, cloud platforms (AWS/GCP), and factory-floor systems automation.
Engineering Lead - Data, AI & Digital Manufacturing
Architect and implement enterprise cloud systems, MES automation, data lakes, and AI pipelines as Engineering Lead - Data, AI & Digital Manufacturing to digitize factory floor operations.
Educational Background
B.Tech / M.Tech in Computer Science, Software Engineering, or Information Systems
Minimum Qualifications
Proficiency in enterprise software architecture, cloud platforms (AWS/GCP), and factory-floor systems automation.
ServiceNow HRSD Architect - Integrations
Architect and implement enterprise cloud systems, MES automation, data lakes, and AI pipelines as ServiceNow HRSD Architect - Integrations to digitize factory floor operations.
Educational Background
B.Tech / M.Tech in Computer Science, Software Engineering, or Information Systems
Minimum Qualifications
Proficiency in enterprise software architecture, cloud platforms (AWS/GCP), and factory-floor systems automation.
SAP S/4 FICO Lead - Costing & Controlling
Architect and implement enterprise cloud systems, MES automation, data lakes, and AI pipelines as SAP S/4 FICO Lead - Costing & Controlling to digitize factory floor operations.
Educational Background
B.Tech / M.Tech in Computer Science, Software Engineering, or Information Systems
Minimum Qualifications
Proficiency in enterprise software architecture, cloud platforms (AWS/GCP), and factory-floor systems automation.
SAP S/4 SD/MM Lead - Manufacturing & Supply Chain
Architect and implement enterprise cloud systems, MES automation, data lakes, and AI pipelines as SAP S/4 SD/MM Lead - Manufacturing & Supply Chain to digitize factory floor operations.
Educational Background
B.Tech / M.Tech in Computer Science, Software Engineering, or Information Systems
Minimum Qualifications
Proficiency in enterprise software architecture, cloud platforms (AWS/GCP), and factory-floor systems automation.
Solution Lead - Electronics Manufacturing (Blue Yonder)
Architect and implement enterprise cloud systems, MES automation, data lakes, and AI pipelines as Solution Lead - Electronics Manufacturing (Blue Yonder) to digitize factory floor operations.
Educational Background
B.Tech / M.Tech in Computer Science, Software Engineering, or Information Systems
Minimum Qualifications
Proficiency in enterprise software architecture, cloud platforms (AWS/GCP), and factory-floor systems automation.
Senior Engineer_Digital
Architect and implement enterprise cloud systems, MES automation, data lakes, and AI pipelines as Senior Engineer_Digital to digitize factory floor operations.
Educational Background
B.Tech / M.Tech in Computer Science, Software Engineering, or Information Systems
Minimum Qualifications
Proficiency in enterprise software architecture, cloud platforms (AWS/GCP), and factory-floor systems automation.
MES Engineer
Architect and implement enterprise cloud systems, MES automation, data lakes, and AI pipelines as MES Engineer to digitize factory floor operations.
Educational Background
B.Tech / M.Tech in Computer Science, Software Engineering, or Information Systems
Minimum Qualifications
Proficiency in enterprise software architecture, cloud platforms (AWS/GCP), and factory-floor systems automation.
DBA (Oracle & SQL)
Architect and implement enterprise cloud systems, MES automation, data lakes, and AI pipelines as DBA (Oracle & SQL) to digitize factory floor operations.
Educational Background
B.Tech / M.Tech in Computer Science, Software Engineering, or Information Systems
Minimum Qualifications
Proficiency in enterprise software architecture, cloud platforms (AWS/GCP), and factory-floor systems automation.
PMO IT
Architect and implement enterprise cloud systems, MES automation, data lakes, and AI pipelines as PMO IT to digitize factory floor operations.
Educational Background
B.Tech / M.Tech in Computer Science, Software Engineering, or Information Systems
Minimum Qualifications
Proficiency in enterprise software architecture, cloud platforms (AWS/GCP), and factory-floor systems automation.
MES Business Analyst
Architect and implement enterprise cloud systems, MES automation, data lakes, and AI pipelines as MES Business Analyst to digitize factory floor operations.
Educational Background
B.Tech / M.Tech in Computer Science, Software Engineering, or Information Systems
Minimum Qualifications
Proficiency in enterprise software architecture, cloud platforms (AWS/GCP), and factory-floor systems automation.
Fab Automation Engineer
Architect and implement enterprise cloud systems, MES automation, data lakes, and AI pipelines as Fab Automation Engineer to digitize factory floor operations.
Educational Background
B.Tech / M.Tech in Computer Science, Software Engineering, or Information Systems
Minimum Qualifications
Proficiency in enterprise software architecture, cloud platforms (AWS/GCP), and factory-floor systems automation.
Senior SiView Engineer
Architect and implement enterprise cloud systems, MES automation, data lakes, and AI pipelines as Senior SiView Engineer to digitize factory floor operations.
Educational Background
B.Tech / M.Tech in Computer Science, Software Engineering, or Information Systems
Minimum Qualifications
Proficiency in enterprise software architecture, cloud platforms (AWS/GCP), and factory-floor systems automation.
Senior SiView Engineer
Architect and implement enterprise cloud systems, MES automation, data lakes, and AI pipelines as Senior SiView Engineer to digitize factory floor operations.
Educational Background
B.Tech / M.Tech in Computer Science, Software Engineering, or Information Systems
Minimum Qualifications
Proficiency in enterprise software architecture, cloud platforms (AWS/GCP), and factory-floor systems automation.
8Supply Chain & Procurement
This team ensures the factory never runs out of raw silicon, specialty gases, or spare parts.
Procurement Director (Fab)
Manage a global, multi-million dollar supply chain. You will source ultra-pure silicon wafers, negotiate with specialty gas vendors (e.g., Air Liquide, Linde), and secure critical tool spare parts.
Educational Background
MBA (Supply Chain) / B.Tech
Minimum Qualifications
10+ years in high-tech procurement. Strong negotiation skills and deep understanding of global semiconductor supply lines.
Import / Export Logistics Managers
Navigate complex international borders. You will ensure smooth customs clearance for billion-dollar equipment and manage the cold-chain logistics required for highly reactive photoresists.
Educational Background
B.BA / B.Com (International Trade)
Minimum Qualifications
5+ years in international logistics. Expert knowledge of Indian customs, DGFT, and handling sensitive/hazardous cargo.
9Internship Programs (Technical & Engineering)
We offer year-round, high-impact internships for students and fresh graduates to work alongside elite process module engineers in our semiconductor fab and packaging line.
Cleanroom Process Intern
Shadow and assist senior process engineers inside the ISO Class 3 cleanroom. Help run test wafers, log defect data, and assist in fine-tuning plasma etch and deposition recipes.
Educational Background
Currently enrolled in B.Tech / M.Tech (Physics, EE, Chemical, or Material Science)
Minimum Qualifications
Top-tier academic record. Demonstrated interest in solid-state physics or microelectronics.
Hardware Automation Intern
Work with the factory automation team to write test scripts for robotic arms and analyze telemetry data from the Overhead Hoist Transport (OHT) system to optimize FOUP routing.
Educational Background
Currently enrolled in B.Tech (Robotics, Mechatronics, or Electronics)
Minimum Qualifications
Strong programming skills (C++/Python). Coursework in control systems or robotics.
Yield Analytics Intern
Dive into massive datasets from our metrology tools. Build Python/R scripts to identify defect correlations and assist the Yield team in finding hidden process anomalies.
Educational Background
Currently enrolled in B.Tech / M.Tech (Data Science, CSE, or Statistics)
Minimum Qualifications
High proficiency in data science, statistics, and machine learning libraries (Pandas, TensorFlow, etc.).
Advanced Packaging Intern
Assist the PCBA line managers. Help run reflow profiles, document AOI machine false-positive rates, and contribute to continuous improvement projects on the assembly floor.
Educational Background
Currently enrolled in B.Tech / Diploma (Electronics, Mechanical, or Industrial)
Minimum Qualifications
Basic understanding of PCB design, thermal dynamics, or industrial manufacturing.
Head - Indirect Sourcing
Architect and implement enterprise cloud systems, MES automation, data lakes, and AI pipelines as Head - Indirect Sourcing to digitize factory floor operations.
Educational Background
B.Tech / M.Tech in Computer Science, Software Engineering, or Information Systems
Minimum Qualifications
Proficiency in enterprise software architecture, cloud platforms (AWS/GCP), and factory-floor systems automation.
Lead - Capex, MRO
Architect and implement enterprise cloud systems, MES automation, data lakes, and AI pipelines as Lead - Capex, MRO to digitize factory floor operations.
Educational Background
B.Tech / M.Tech in Computer Science, Software Engineering, or Information Systems
Minimum Qualifications
Proficiency in enterprise software architecture, cloud platforms (AWS/GCP), and factory-floor systems automation.
SCM Governance & Compliance Lead
Architect and implement enterprise cloud systems, MES automation, data lakes, and AI pipelines as SCM Governance & Compliance Lead to digitize factory floor operations.
Educational Background
B.Tech / M.Tech in Computer Science, Software Engineering, or Information Systems
Minimum Qualifications
Proficiency in enterprise software architecture, cloud platforms (AWS/GCP), and factory-floor systems automation.
Lead - Commercial Sourcing
Architect and implement enterprise cloud systems, MES automation, data lakes, and AI pipelines as Lead - Commercial Sourcing to digitize factory floor operations.
Educational Background
B.Tech / M.Tech in Computer Science, Software Engineering, or Information Systems
Minimum Qualifications
Proficiency in enterprise software architecture, cloud platforms (AWS/GCP), and factory-floor systems automation.
Senior Officer II_Supply Chain Management
Architect and implement enterprise cloud systems, MES automation, data lakes, and AI pipelines as Senior Officer II_Supply Chain Management to digitize factory floor operations.
Educational Background
B.Tech / M.Tech in Computer Science, Software Engineering, or Information Systems
Minimum Qualifications
Proficiency in enterprise software architecture, cloud platforms (AWS/GCP), and factory-floor systems automation.
Manager_Supply Chain Management
Architect and implement enterprise cloud systems, MES automation, data lakes, and AI pipelines as Manager_Supply Chain Management to digitize factory floor operations.
Educational Background
B.Tech / M.Tech in Computer Science, Software Engineering, or Information Systems
Minimum Qualifications
Proficiency in enterprise software architecture, cloud platforms (AWS/GCP), and factory-floor systems automation.
Manager_Supply Chain Management
Architect and implement enterprise cloud systems, MES automation, data lakes, and AI pipelines as Manager_Supply Chain Management to digitize factory floor operations.
Educational Background
B.Tech / M.Tech in Computer Science, Software Engineering, or Information Systems
Minimum Qualifications
Proficiency in enterprise software architecture, cloud platforms (AWS/GCP), and factory-floor systems automation.
Senior Officer II_Supply Chain Management
Architect and implement enterprise cloud systems, MES automation, data lakes, and AI pipelines as Senior Officer II_Supply Chain Management to digitize factory floor operations.
Educational Background
B.Tech / M.Tech in Computer Science, Software Engineering, or Information Systems
Minimum Qualifications
Proficiency in enterprise software architecture, cloud platforms (AWS/GCP), and factory-floor systems automation.
Senior Officer II_Supply Chain Management
Architect and implement enterprise cloud systems, MES automation, data lakes, and AI pipelines as Senior Officer II_Supply Chain Management to digitize factory floor operations.
Educational Background
B.Tech / M.Tech in Computer Science, Software Engineering, or Information Systems
Minimum Qualifications
Proficiency in enterprise software architecture, cloud platforms (AWS/GCP), and factory-floor systems automation.
Senior Officer II_Supply Chain Management
Architect and implement enterprise cloud systems, MES automation, data lakes, and AI pipelines as Senior Officer II_Supply Chain Management to digitize factory floor operations.
Educational Background
B.Tech / M.Tech in Computer Science, Software Engineering, or Information Systems
Minimum Qualifications
Proficiency in enterprise software architecture, cloud platforms (AWS/GCP), and factory-floor systems automation.
Senior Officer II_Supply Chain Management
Architect and implement enterprise cloud systems, MES automation, data lakes, and AI pipelines as Senior Officer II_Supply Chain Management to digitize factory floor operations.
Educational Background
B.Tech / M.Tech in Computer Science, Software Engineering, or Information Systems
Minimum Qualifications
Proficiency in enterprise software architecture, cloud platforms (AWS/GCP), and factory-floor systems automation.
Manager_Supply Chain Management
Architect and implement enterprise cloud systems, MES automation, data lakes, and AI pipelines as Manager_Supply Chain Management to digitize factory floor operations.
Educational Background
B.Tech / M.Tech in Computer Science, Software Engineering, or Information Systems
Minimum Qualifications
Proficiency in enterprise software architecture, cloud platforms (AWS/GCP), and factory-floor systems automation.
Semiconductor Manufacturing Equipment Expert
Architect and implement enterprise cloud systems, MES automation, data lakes, and AI pipelines as Semiconductor Manufacturing Equipment Expert to digitize factory floor operations.
Educational Background
B.Tech / M.Tech in Computer Science, Software Engineering, or Information Systems
Minimum Qualifications
Proficiency in enterprise software architecture, cloud platforms (AWS/GCP), and factory-floor systems automation.
Semiconductor Manufacturing Equipment Expert
Architect and implement enterprise cloud systems, MES automation, data lakes, and AI pipelines as Semiconductor Manufacturing Equipment Expert to digitize factory floor operations.
Educational Background
B.Tech / M.Tech in Computer Science, Software Engineering, or Information Systems
Minimum Qualifications
Proficiency in enterprise software architecture, cloud platforms (AWS/GCP), and factory-floor systems automation.
Spare Parts Sourcing Engineer
Architect and implement enterprise cloud systems, MES automation, data lakes, and AI pipelines as Spare Parts Sourcing Engineer to digitize factory floor operations.
Educational Background
B.Tech / M.Tech in Computer Science, Software Engineering, or Information Systems
Minimum Qualifications
Proficiency in enterprise software architecture, cloud platforms (AWS/GCP), and factory-floor systems automation.
11Office & Administrative Support
Our administrative team manages and coordinates daily operations, human resources, facilities support, and financial record-keeping across our 7-acre technology park.
Office Administrator
Keep the campus running smoothly. Manage vendor contracts for office supplies, coordinate complex executive schedules, and ensure the administrative building operates flawlessly.
Educational Background
Bachelor's Degree in Business Administration, Commerce, or related fields
Minimum Qualifications
5+ years in office administration. Exceptional organizational and communication skills.
HR Executive / Recruiter
Help us build the 3,000-strong workforce. Source elite engineering talent, manage the rigorous onboarding process for cleanroom protocols, and foster a culture of excellence.
Educational Background
MBA in Human Resources / PGDM
Minimum Qualifications
3+ years in technical/industrial recruiting. Experience recruiting for specialized engineering roles is a major plus.
Accounts & Billing Assistant
Support the massive financial operations of the fab. Process vendor invoices, reconcile accounts, and ensure strict compliance with GST and corporate accounting standards.
Educational Background
Bachelor of Commerce (B.Com) / M.Com
Minimum Qualifications
2+ years in accounting. Proficiency in Tally/ERP systems and strong attention to numerical detail.
Front Desk & Reception Coordinator
Be the face of INDNIX. Greet international dignitaries, government officials, and vendors. Manage highly secure access control logs for the campus.
Educational Background
Graduate in any discipline with excellent verbal and written communication
Minimum Qualifications
Impeccable communication skills and a professional demeanor. Experience in a highly secure corporate environment is preferred.
Data Entry & Document Controller
Maintain our vast library of standard operating procedures (SOPs). Ensure all process documents are perfectly digitized, version-controlled, and entered into the ERP system accurately.
Educational Background
Graduate with high typing speed and professional accuracy
Minimum Qualifications
High typing speed with near-perfect accuracy. Experience with document control systems (e.g., Agile, Documentum).
Ready to apply?
Submit your resume and cover letter. Our recruitment team will review your application against our strict operational requirements.