Assembly & Test
High-precision surface-mount technology and printed circuit board assembly. Multi-layer PCBs, BGA rework, AOI inspection, and full traceability.
Quick Specs
Core Capabilities
Our operations provide specialized, uncompromising capabilities for assembly & test. We deliver robust, scalable execution from initial design through high-volume production.
How It Works
Our end-to-end manufacturing workflow from design review through final quality validation.
Design Review (DFM)
Analyzing Gerber files and BOM to ensure manufacturability and prevent defects. This foundational process ensures unparalleled reliability, scaling efficiently from small prototype phases to massive, global production volumes.
Solder Paste Printing
Applying precise amounts of solder paste to the PCB pads using stencils. This foundational process ensures unparalleled reliability, scaling efficiently from small prototype phases to massive, global production volumes.
Pick & Place SMT
Automated mounting of surface-mount components onto the PCB with high speed and accuracy. This foundational process ensures unparalleled reliability, scaling efficiently from small prototype phases to massive, global production volumes.
Reflow Soldering
Passing boards through a multi-zone reflow oven to melt paste and form solid solder joints. This foundational process ensures unparalleled reliability, scaling efficiently from small prototype phases to massive, global production volumes.
Inspection & THT
AOI/X-Ray inspection followed by any necessary through-hole component wave soldering. This foundational process ensures unparalleled reliability, scaling efficiently from small prototype phases to massive, global production volumes.
Testing & QA
Executing ICT, functional tests, and final quality control checks before packaging. This foundational process ensures unparalleled reliability, scaling efficiently from small prototype phases to massive, global production volumes.
Technical Specifications
Detailed specifications and manufacturing parameters.
Quality & Standards
Target Applications
Ready to start your project?
Speak with our assembly & test experts to review your specifications, plan your ramp, and get a custom quote.
Frequently Asked Questions
Need more technical details? Find answers below or contact our engineering team.
Advanced Semiconductor Manufacturing Excellence
In the highly competitive landscape of global technology, INDNIX stands at the forefront of advanced semiconductor manufacturing, industrial automation, and enterprise-grade software solutions.
Silicon to Assembly
End-to-end solutions spanning from initial microscopic silicon design to high-volume macroscopic assembly lines.
Complex Orchestration
Profound orchestration of supply chains instead of merely relying on hardware scaling trends like Moore's Law.
Strict Quality Control
Systemic operational transparency enforcing uncompromising quality controls and defect elimination.
Unprecedented Efficiency
Integrating high-capacity hardware lines with cloud-native software drives maximum theoretical yield parameters.
Unwavering Commitment to Quality & Traceability
When industries ranging from automotive to aerospace partner with INDNIX, they invest in an unwavering commitment to quality. Defect density is not an abstract metric; it is a critical vulnerability.
DFM and DFT Methodologies: Constructing highly sophisticated digital twins of every product for rigorous thermal and stress modeling before fabrication.
High-resolution AOI & 3D X-Ray: Ensuring every via, trace, and component is analyzed in real-time.
Rigid International Standards: Complete compliance with ISO 9001, IATF 16949, and AEC-Q100.
Software-Defined Manufacturing
Traditional manufacturing relies heavily on siloed systems creating debilitating blind spots. We've engineered a radical departure by developing completely unified digital infrastructure.
Dynamic Sourcing
Algorithms ingest terabytes of telemetry data, orchestrating procurement routing and predictive maintenance continuously.
Hyper-Resilient Pipeline
Remarkably immune to conventional macroeconomic supply disruptions or localized shortages via neural networks.
Digital Control Plane
Abstracting physical complexity to provide partners unprecedented real-time visibility into their product lifecycle.
Scaling Across Diverse Sectors
Our core capabilities service specialized sectors efficiently. From 28nm-65nm microprocessors delivering low-power IoT performance, to compound GaAs and InP RF amplifiers for 5G, and robust PMICs for the demanding EV market.
Sustainable Engineering & Future
The environmental impact of industrial scalability cannot be ignored. We pioneer environmentally conscious manufacturing, implementing recycling loops to minimize chemical runoff and reduce water consumption.
Aligning with a visionary partner building a smarter, cleaner world.
Get in Touch
Whether you're looking to secure autonomous semiconductor supply chains or orchestrate global deployments, our execution teams are ready.
Send us a message
INDNIX Technology Limited
Rishi Bankim Shilpaudyan, Naihati, West Bengal, 743165, India
Headquarters
INDNIX Technology Limited
Rishi Bankim Shilpaudyan, Naihati, WB
Direct Line
+91-8100488233
Official Inquiry
official@indnix.com