Technology & Innovation

At the core of INDNIX is an uncompromising commitment to process excellence. Our state-of-the-art facilities offer a comprehensive suite of semiconductor technologies to meet the diverse needs of the global electronics industry.

Process Nodes

28nm to 180nm+ capabilities across Analog, RF, and Power.

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Advanced Packaging

SiP, Flip-Chip, and Wire Bonding for mission-critical applications.

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Quality & Reliability

AEC-Q100 and ISO-certified metrology and burn-in testing.

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EDA Ecosystem

PDKs and design rules for Cadence, Synopsys, and Mentor.

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Research & Development

Pushing boundaries in III-V compounds and advanced architectures.

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