Technology & Innovation
At the core of INDNIX is an uncompromising commitment to process excellence. Our state-of-the-art facilities offer a comprehensive suite of semiconductor technologies to meet the diverse needs of the global electronics industry.
Our Technology Portfolio
From foundry process nodes to advanced packaging, explore the full breadth of our semiconductor capabilities.
Process Nodes
28nm to 180nm+ capabilities across Analog, RF, BCD, and Power technologies for automotive, industrial, and IoT applications.
Compound & MEMS
III-V compound semiconductor and MEMS fabrication for optical, radar, and advanced sensing applications.
Advanced Packaging
SiP, Flip-Chip BGA, and Wafer-Level CSP solutions for high-density, mission-critical applications.
Quality & Reliability
AEC-Q100, ISO 9001, and IATF 16949 certified metrology, burn-in, and reliability testing.
EDA Ecosystem
Silicon-verified PDKs and IP libraries with Cadence, Synopsys, Siemens EDA, and Ansys partnerships.
Research & Development
Next-generation wide bandgap materials, advanced MEMS, and novel device architectures.
Ready to Start Your Next Project?
Our engineering team is ready to discuss your requirements and recommend the optimal technology platform for your application.