Engineering India's Semiconductor Future
SEMICONDUCTOR MANUFACTURING

Engineering India's Semiconductor Future

From 28nm wafer fabrication to AI datacenter infrastructure — building sovereign silicon capability at Haringhata, West Bengal.

Official Government Land Allotment — West Bengal
Soham Biswas receiving official land allotment document for INDNIX's Semiconductor Manufacturing Unit at the West Bengal Government ceremony

Soham Biswas, Chairman & MD

Receiving the Official Land Allotment Document for Semiconductor Manufacturing Unit at Milan Mela Prangan, Kolkata.

Land Allotted.
Mega-Fab Begins.

In a historic milestone for India's semiconductor sovereignty, the Government of West Bengal officially allotted land to INDNIX Technology Limited at the Haringhata Industrial Park, Nadia — formally handed over at the State Land Allotment Ceremony.

Haringhata, NadiaWest Bengal, India
35.40 AcresOfficial Plot Allotted
September 2026Land Possession Date

"Receiving land at Haringhata Industrial Park is not just a milestone — it is the moment INDNIX becomes real for Bengal and for India."

— Soham Biswas, Chairman & MD
VERTICAL FOUNDRY DIVISIONS

Integrated Manufacturing
Capabilities

From 28nm silicon wafer fabrication to turnkey OSAT packaging — all vertically integrated on our sovereign 35.40-acre campus.

DIRECT FAB ACCESS & RESEARCH ALLIANCE

Empowering India's Next
Semiconductor Startups & Universities

INDNIX bridges the gap between deeptech innovation and high-volume commercial semiconductor manufacturing. We provide direct Class 1 cleanroom fabrication, Multi-Project Wafer (MPW) shuttles, and joint R&D for startups and academic institutions.

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Multi-Project Wafer (MPW) Shuttles
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ISO Class 2 / 3 Cleanroom Tool Access
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Joint Patent Filing & Sponsored R&D
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100% Startup & Institute IP Ownership
INFRASTRUCTURE ARCHITECTURE

Integrated Semiconductor
Mega-Fab Complex

Eastern India’s first sovereign vertically integrated mega-fab. Our highly secure 35.40-acre campus features a Stage 1 Target Capacity of 70,000 Wafer Starts Per Month (WSPM) across three heavily segregated manufacturing divisions.

Silicon Front-End Foundry

Silicon Front-End Foundry

Our core revenue driver focusing on high-volume production of logic, analog, and PMICs. Built on massive concrete 'Waffle Slabs' for micro-seismic isolation.

Process Node28nm & 45nm–180nm
Wafer Size300mm & 200mm
CleanroomISO Class 2 & 3
Area8.50 Acres
Explore Division Specs
Compound Semiconductor & MEMS Fab

Compound Semiconductor & MEMS Fab

Physically isolated cleanroom for exotic materials (GaAs, InP) preventing cross-contamination. Utilizes DRIE to carve microscopic cavities for MEMS sensors.

MaterialsGaAs, InP
Specialty ToolsMBE, MOCVD
Applications5G/6G RF & MEMS
Area2.50 Acres
Explore Division Specs
ATMP / SMT Backend Assembly

ATMP / SMT Backend Assembly

Captures value across the supply chain. Wafers are thinned, laser-diced, and packaged into finished, market-ready engine control units (ECUs) via PCBA.

ATMPUltrasonic Wire Bond
Inspection3D AOI & AXI
SMT TechNitrogen Reflow
Area4.00 Acres
Explore Division Specs
35.40-ACRE SITE MASTERPLAN

Integrated Semiconductor
Mega-Fab Complex

A sovereign state-of-the-art facility engineered for sub-micron cleanrooms, bulk specialty chemical delivery, cryogenic storage, and vibration-isolated waffle slabs.

Fab Plant Masterplan Layout
SUB-MICRON CLEANROOM & METROLOGY

Facility Operations
Showcase

Step inside our manufacturing lines. Explore the high-fidelity metrology logs, precision metrics, and cleanroom hardware powering our output.

ISO Class 5 Cleanroom

ISO Class 5 Cleanroom

Wafer fabrication cleanroom facility utilizing advanced ArF lithography systems and robotic wafer handling tracks.

Filtration:0.1 Micron HEPA
Humidity:45% +/- 2%
Robotic SMT Assembly Lines

Robotic SMT Assembly Lines

High-speed surface mount technology placing microscopic components on motherboards with sub-micron precision.

Orchestration Speed:45,000 CPH
Placement Accuracy:10 Microns
Wafer Probe Metrology

Wafer Probe Metrology

Macro silicon wafer testing under optical microscopes and ultra-fine probe cards to identify electrical node faults.

Probe Node Pitch:40 Microns
Test Frequency:Up to 1.2 GHz
Advanced Chip Packaging

Advanced Chip Packaging

Microscopic wire-bonding micro-lenses attaching gold and copper wire traces to raw silicon core dies.

Wire Diameter:15 Microns (Au)
Bond Pull Strength:>12g Force
TELEMETRY & SCALE

Scale That Speaks

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Operating Divisions

Vertically integrated

0–180nm

Process Nodes

Silicon CMOS range

0+

Planned Jobs

Employment target

0 Acres

Campus Size

Haringhata, WB

0/7

Operations

Round-the-clock

0B

Investment (₹)

Phase 1 committed

FOUNDRY TECHNOLOGY MATRIX

World-Class
Capabilities

Explore Full Technology Stack
28nm – 180nm Silicon CMOS

28nm – 180nm Silicon CMOS

Our silicon CMOS foundry delivers mixed-signal, RF, and power management ICs across mature and mid-range nodes. With industry-leading yield rates and a commitment to quality, every wafer that leaves our facility meets the highest standards.

Process Range

28nm – 180nm+

Wafer Diameter

200mm / 300mm

Lithography

ArF 193nm Dry

Yield Rates

Industry Leading

Sustainability
ESG & SUSTAINABLE FOUNDRY

Responsible Manufacturing for a Greener India

Our commitment extends beyond silicon. Closed-loop water reclamation, rooftop & solar farm power, and zero-hazardous landfill policies are engineered directly into Bengal Mega-Fab.

85%

Water Recovery

Reclamation target

40%

Solar Power

Renewable energy share

90%

Zero Waste

Recycling rate

2035

Net-Zero

Carbon neutral target

GLOBAL CERTIFICATIONS & ALLIANCES

ISO 9001Quality Management
ISO 14001Environmental
IATF 16949Automotive Quality
AEC-Q100Reliability Standard
RoHS CompliantEnvironmental Safety
IPC Class IIIAssembly Standard
Make in IndiaGovernment Initiative
India Semiconductor MissionStrategic Partner
ISO 9001Quality Management
ISO 14001Environmental
IATF 16949Automotive Quality
AEC-Q100Reliability Standard
RoHS CompliantEnvironmental Safety
IPC Class IIIAssembly Standard
Make in IndiaGovernment Initiative
India Semiconductor MissionStrategic Partner