Legacy Nodes 90nm–180nm+

Power

Power Management ICs (PMICs), DC-DC converters, LDOs, battery management, and multi-rail PMICs for consumer and automotive.

Quick Specs

TechnologyBCD (Bipolar-CMOS-DMOS)
Nodes90nm to 350nm+
Voltage Ratings5V to 100V+ Integrated
Current CapabilityUp to 10A+ per channel
Production Ready
Capabilities

Core Capabilities

Our operations provide specialized, uncompromising capabilities for power. We deliver robust, scalable execution from initial design through high-volume production.

Comprehensive integration and deployment of advanced enterprise architectures
Scalable infrastructure designed for extremely high-availability and fault-tolerance
Strategic optimization of global semiconductor supply chain networks
Rigorous adherence to compliance, security, and next-generation manufacturing protocols
Advanced predictive analytics for yield management and defect reduction
High-Voltage BCD Processes
Power Management ICs (PMIC)
DC-DC Converters & LDOs
Battery Management Systems
Motor Drive Controllers
Trench MOSFETs & IGBTs
Process

How It Works

Our end-to-end manufacturing workflow from design review through final quality validation.

01

Device Engineering

Customizing LDMOS and power device structures for target breakdown voltages. This foundational process ensures unparalleled reliability, scaling efficiently from small prototype phases to massive, global production volumes.

02

Deep Trench Isolation

Creating thick isolation trenches to prevent latch-up and allow high-voltage operation. This foundational process ensures unparalleled reliability, scaling efficiently from small prototype phases to massive, global production volumes.

03

Epi Growth

Growing thick epitaxial layers for handling high breakdown voltages. This foundational process ensures unparalleled reliability, scaling efficiently from small prototype phases to massive, global production volumes.

04

Metalization

Depositing ultra-thick Top Metal for high current carrying capability and low Rdson. This foundational process ensures unparalleled reliability, scaling efficiently from small prototype phases to massive, global production volumes.

05

Parametric Test

High-voltage and extreme thermal pulsing to verify power device robustness. This foundational process ensures unparalleled reliability, scaling efficiently from small prototype phases to massive, global production volumes.

06

Power Packaging

Assembling into thermally enhanced packages (e.g.

Specifications

Technical Specifications

Detailed specifications and manufacturing parameters.

Technology
BCD (Bipolar-CMOS-DMOS)
Nodes
90nm to 350nm+
Voltage Ratings
5V to 100V+ Integrated
Current Capability
Up to 10A+ per channel
Thermal Performance
Junction temps up to 175°C
Quality

Quality & Standards

AEC-Q100 Grade 0 & Grade 1
ISO 26262 ASIL-D Ready Flows
Zero Defect Manufacturing Initiatives
Applications

Target Applications

EV Battery Management Systems
Mobile Device Fast Charging
Industrial Motor Control
Server Power Supplies
LED Lighting Drivers

Ready to start your project?

Speak with our power experts to review your specifications, plan your ramp, and get a custom quote.

FAQ

Frequently Asked Questions

Need more technical details? Find answers below or contact our engineering team.

Excellence

Advanced Semiconductor Manufacturing Excellence

In the highly competitive landscape of global technology, INDNIX stands at the forefront of advanced semiconductor manufacturing, industrial automation, and enterprise-grade software solutions.

Silicon to Assembly

End-to-end solutions spanning from initial microscopic silicon design to high-volume macroscopic assembly lines.

Complex Orchestration

Profound orchestration of supply chains instead of merely relying on hardware scaling trends like Moore's Law.

Strict Quality Control

Systemic operational transparency enforcing uncompromising quality controls and defect elimination.

Unprecedented Efficiency

Integrating high-capacity hardware lines with cloud-native software drives maximum theoretical yield parameters.

Unwavering Commitment to Quality & Traceability

When industries ranging from automotive to aerospace partner with INDNIX, they invest in an unwavering commitment to quality. Defect density is not an abstract metric; it is a critical vulnerability.

  • DFM and DFT Methodologies: Constructing highly sophisticated digital twins of every product for rigorous thermal and stress modeling before fabrication.

  • High-resolution AOI & 3D X-Ray: Ensuring every via, trace, and component is analyzed in real-time.

  • Rigid International Standards: Complete compliance with ISO 9001, IATF 16949, and AEC-Q100.

Software-Defined Manufacturing

Traditional manufacturing relies heavily on siloed systems creating debilitating blind spots. We've engineered a radical departure by developing completely unified digital infrastructure.

Dynamic Sourcing

Algorithms ingest terabytes of telemetry data, orchestrating procurement routing and predictive maintenance continuously.

Hyper-Resilient Pipeline

Remarkably immune to conventional macroeconomic supply disruptions or localized shortages via neural networks.

Digital Control Plane

Abstracting physical complexity to provide partners unprecedented real-time visibility into their product lifecycle.

Scaling Across Diverse Sectors

Our core capabilities service specialized sectors efficiently. From 28nm-65nm microprocessors delivering low-power IoT performance, to compound GaAs and InP RF amplifiers for 5G, and robust PMICs for the demanding EV market.

IoT Microprocessors5G InfrastructureElectric Vehicles

Sustainable Engineering & Future

The environmental impact of industrial scalability cannot be ignored. We pioneer environmentally conscious manufacturing, implementing recycling loops to minimize chemical runoff and reduce water consumption.

Aligning with a visionary partner building a smarter, cleaner world.

Contact

Get in Touch

Whether you're looking to secure autonomous semiconductor supply chains or orchestrate global deployments, our execution teams are ready.

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INDNIX Technology Limited

Rishi Bankim Shilpaudyan, Naihati, West Bengal, 743165, India

Headquarters

INDNIX Technology Limited

Rishi Bankim Shilpaudyan, Naihati, WB

Direct Line

+91-8100488233

Official Inquiry

official@indnix.com