Advanced Packaging

Technology

Engineering Support

Discuss custom solutions with our engineering team.

Moore's Law is evolving. As monolithic scaling slows, heterogeneous integration via advanced packaging becomes the primary driver of performance and form-factor innovation.

System-in-Package (SiP) Solutions

We integrate disparate silicon elements (Logic, Memory, RF, MEMS) from different technology nodes into a single, highly miniaturized package, drastically reducing PCB footprint and improving signal integrity.

Flip-Chip BGA

Wafer Level CSP

Multi-Chip Modules