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Explore our specialized capabilities and strategic perspectives on Process.
Return to HomeOur commitment to our vision drives everything we do. We combine decades of domain expertise with cutting-edge cloud software and automated production lines to deliver unprecedented results.
We execute two distinct frontend process paradigms within our facilities, defined by rigorous systemic isolation to prevent cross-contamination.
Initial wet chemical cleaning of high-purity 200mm/300mm p-type silicon. Isolation via Shallow Trench Isolation (STI) using dry ArF lithography.
High-energy ion implantation followed by thermal drive-in annealing generates deep n-well and p-well regions.
Ultra-thin oxide growth paired with polysilicon layer chemical vapor deposition, leveraging copper dual-damascene workflows.
Metal-Organic Chemical Vapor Deposition growth of active Gallium Arsenide (GaAs) or Indium Phosphide (InP) single-crystal compound layers.
Deep MEMS structures require thick resist profiles followed by DRIE utilizing the cyclic Bosch method.
Specialized electron-beam evaporation deposits non-oxidizing layers. Automated wafer bonding hermetically locks the active and physical MEMS sensor chambers.
A signature challenge of our mixed-use park is preventing cross-contamination. Our Silicon Logic facility operates as a strict Zero-Gold zone, utilizing completely isolated HVAC systems, separate chemical drainage loops, and dedicated sub-fab toxic gas scrubbers.
Whether you're looking to secure autonomous semiconductor supply chains or orchestrate global deployments, our execution teams are ready.
Rishi Bankim Shilpaudyan, Naihati, West Bengal, 743165, India
Headquarters
Rishi Bankim Shilpaudyan, Naihati, WB
Direct Line
+91-8100488233
Official Inquiry
official@indnix.com